- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/10 - Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Patent holdings for IPC class H01L 23/10
Total number of patents in this class: 1454
10-year publication summary
145
|
114
|
106
|
139
|
137
|
104
|
84
|
84
|
84
|
31
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
127 |
Mitsubishi Electric Corporation | 43934 |
68 |
Murata Manufacturing Co., Ltd. | 22355 |
34 |
Intel Corporation | 45621 |
32 |
Fuji Electric Co., Ltd. | 4750 |
28 |
Nippon Electric Glass Co., Ltd. | 2299 |
26 |
Texas Instruments Incorporated | 19376 |
25 |
Samsung Electronics Co., Ltd. | 131630 |
23 |
Raytheon Company | 8535 |
22 |
Kyocera Corporation | 12735 |
22 |
International Business Machines Corporation | 60644 |
21 |
Infineon Technologies AG | 8189 |
20 |
Semiconductor Components Industries, L.L.C. | 5345 |
20 |
Advanced Semiconductor Engineering, Inc. | 1546 |
19 |
Denso Corporation | 23338 |
17 |
Apple Inc. | 50209 |
13 |
Robert Bosch GmbH | 40953 |
13 |
Invensas Corporation | 645 |
13 |
Qorvo US, Inc. | 2018 |
13 |
STATS ChipPAC Pte. Lte. | 1516 |
13 |
Other owners | 885 |